New Fully Automatic Laser Depaneling Machine – Capable of Cutting PCB/FPC in Any Shape

Our facility introduce multiple fully automated laser depaneling machine in 2025.

1) The machine features ultra-high board cutting efficiency, supports rapid line changeover, micron-level high-precision cutting, and automatic positioning/focusing.

2) Its built-in suction system completely removes cutting exhaust fumes, eliminating hazards and environmental pollution.

3) Capable of cutting PCB/FPC boards of any shape, it seamlessly interfaces with front and rear automated production lines.

4) Suitable for micro-fine processing of various materials, applications include: high-precision rapid full cutting of PCB contours

(including pre-assembled circuit boards), PCB breakpoint cutting, FPC profile cutting, rigid-flex circuit board lid removal, and outline cutting operations.